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sklademVydáno: 2024-12-13
24/30502907 DC
BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods Part 22-2: Bond strength - Wire bond shear test methods
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| Označení normy: | 24/30502907 DC |
| Počet stran: | 34 |
| Vydáno: | 2024-12-13 |
| Status: | Draft for Comment |
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24/30502907 DC
This standard 24/30502907 DC BS EN IEC 60749-22-2 Semiconductor devices - Mechanical and climatic test methods is classified in these ICS categories:
- 31.080.01 Semiconductor devices in general