Hlavní stránka>BS EN 60191-6-19:2010 Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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sklademVydáno: 2010-06-30
BS EN 60191-6-19:2010
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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This standard BS EN 60191-6-19:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
31.080.01 Semiconductor devices in general
This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
