Přihlásit seRegistrovat se
Jazyk czen
Menu
KontaktOBCHODNÁPOVĚDAE-ReadingNovinky
Hledání
0
Celková cena
0 Kč
Cena s DPH / bez DPH
Hlavní stránka>BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Sponsored link
sklademVydáno: 2003-03-04
BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

BS EN 60191-6-2:2002

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
4154 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
Čtení normy
na 1 hodinu
415.40 Kč
Čtěte normu po dobu 24 hodin. Více informací v kategorii E-READING
Čtení normy
na 24 hodin
1246.20 Kč
Anglicky Tisk
Skladem
4154 Kč
Označení normy:BS EN 60191-6-2:2002
Počet stran:14
Vydáno:2003-03-04
ISBN:0 580 39260 0
Status:Standard
Popis

BS EN 60191-6-2:2002


This standard BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 01.100.25 Electrical and electronics engineering drawings
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Tisk