Cena s DPH / bez DPH
Hlavní stránka>BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
Sponsored link
sklademVydáno: 2010-12-31
BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

BS EN 60191-6-21:2010

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
4650 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
Čtení normy
na 1 hodinu
465.00 Kč
Čtěte normu po dobu 24 hodin. Více informací v kategorii E-READING
Čtení normy
na 24 hodin
1395.00 Kč
Anglicky Tisk
Skladem
4650 Kč
Označení normy:BS EN 60191-6-21:2010
Počet stran:18
Vydáno:2010-12-31
ISBN:978 0 580 64567 9
Status:Standard
Popis

BS EN 60191-6-21:2010


This standard BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 35.100.05 Multilayer applications
  • 35.110 Networking
  • 25.040.40 Industrial process measurement and control
  • 31.080.01 Semiconductor devices in general

This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.