Hlavní stránka>BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
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sklademVydáno: 2010-12-31
BS EN 60191-6-21:2010
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
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This standard BS EN 60191-6-21:2010 Mechanical standardization of semiconductor devices is classified in these ICS categories:
35.100.05 Multilayer applications
35.110 Networking
25.040.40 Industrial process measurement and control
31.080.01 Semiconductor devices in general
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
