Hlavní stránka>BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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sklademVydáno: 2003-08-04
BS EN 60191-6-4:2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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This standard BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
31.080.01 Semiconductor devices in general
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
