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Hlavní stránka>BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
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sklademVydáno: 2003-08-04
BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

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Označení normy:BS EN 60191-6-4:2003
Počet stran:20
Vydáno:2003-08-04
ISBN:0 580 42356 5
Status:Standard
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BS EN 60191-6-4:2003


This standard BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
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