Cena s DPH / bez DPH
Hlavní stránka>BS EN 60749-27:2006+A1:2012 Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
Sponsored link
sklademVydáno: 2013-01-31
BS EN 60749-27:2006+A1:2012 Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)

BS EN 60749-27:2006+A1:2012

Semiconductor devices. Mechanical and climatic test methods Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)

Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
4650 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
Čtení normy
na 1 hodinu
465.00 Kč
Čtěte normu po dobu 24 hodin. Více informací v kategorii E-READING
Čtení normy
na 24 hodin
1395.00 Kč
Anglicky Tisk
Skladem
4650 Kč
Označení normy:BS EN 60749-27:2006+A1:2012
Počet stran:16
Vydáno:2013-01-31
ISBN:978 0 580 76608 4
Status:Standard
Popis

BS EN 60749-27:2006+A1:2012


This standard BS EN 60749-27:2006+A1:2012 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general

This part of IEC 60749 establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposureto a defined machine model (MM) electrostatic discharge (ESD). It may be used as an alternative test method to the human body model ESD test method. The objective is to provide reliable, repeatable ESD test results so that accurate classifications can be performed.

This test method is applicable to all semiconductor devices and is classified as destructive.

ESD testing of semiconductor devices is selected from this test method, the human body model (HBM – see IEC 60749-26) or other test methods in the IEC 60749 series. The MM and HBM test methods produce similar but not identical results. Unless otherwise specified, the HBM test method is the one selected.

NOTE 1 This test method does not truly simulate discharge from real machines or metallic tools because the test method uses high parasitic inductance of the test circuit, whereas real machines and metallic tools, whose discharge rise time is approximately 100 ps, have no inductance.

NOTE 2 Certain clauses in this test method are in accordance with IEC 61340-3-2.