Hlavní stránka>BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
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sklademVydáno: 2003-06-26
BS EN 61188-5-6:2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
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This standard BS EN 61188-5-6:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations is classified in these ICS categories:
31.190 Electronic component assemblies
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
