Hlavní stránka>BS EN IEC 60749-20:2020 Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Sponsored link
sklademVydáno: 2020-10-14
BS EN IEC 60749-20:2020
Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
6820 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
This standard BS EN IEC 60749-20:2020 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
31.080.01 Semiconductor devices in general
IEC 60749-20:2020 is available as IEC 60749-20:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-20:2020 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This edition includes the following significant technical changes with respect to the previous edition: - incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition ); - inclusion of new Clause 3; - inclusion of explanatory notes.
