Přihlásit seRegistrovat se
Jazyk czen
Menu
KontaktOBCHODNÁPOVĚDAE-ReadingNovinky
Hledání
0
Celková cena
0 Kč
Cena s DPH / bez DPH
Hlavní stránka>BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Sponsored link
sklademVydáno: 2022-03-07
BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

BS EN IEC 60749-39:2022

Semiconductor devices. Mechanical and climatic test methods Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
4650 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
Čtení normy
na 1 hodinu
465.00 Kč
Čtěte normu po dobu 24 hodin. Více informací v kategorii E-READING
Čtení normy
na 24 hodin
1395.00 Kč
Anglicky Tisk
Skladem
4650 Kč
Označení normy:BS EN IEC 60749-39:2022
Počet stran:18
Vydáno:2022-03-07
ISBN:978 0 539 15200 5
Status:Standard
Popis

BS EN IEC 60749-39:2022


This standard BS EN IEC 60749-39:2022 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60749-39:2021 is available as IEC 60749-39:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-39:2021 details the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow. This edition includes the following significant technical changes with respect to the previous edition: - updated procedure for "dry weight" determination.
Tisk