Hlavní stránka>BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
Sponsored link
sklademVydáno: 2023-09-13
BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards
Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
4154 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
This standard BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
31.180 Printed circuits and boards
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
