Přihlásit seRegistrovat se
Jazyk czen
Menu
KontaktOBCHODNÁPOVĚDAE-ReadingNovinky
Hledání
0
Celková cena
0 Kč
Cena s DPH / bez DPH
Hlavní stránka>BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
Sponsored link
sklademVydáno: 2023-06-22
BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

BS EN IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad

Formát
Dostupnost
Cena a měna
Anglicky Zabezpečené PDF
K okamžitému stažení
4650 Kč
Čtěte normu po dobu 1 hodiny. Více informací v kategorii E-READING
Čtení normy
na 1 hodinu
465.00 Kč
Čtěte normu po dobu 24 hodin. Více informací v kategorii E-READING
Čtení normy
na 24 hodin
1395.00 Kč
Anglicky Tisk
Skladem
4650 Kč
Označení normy:BS EN IEC 61249-2-51:2023
Počet stran:22
Vydáno:2023-06-22
ISBN:978 0 539 18768 7
Status:Standard
Popis

BS EN IEC 61249-2-51:2023


This standard BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
  • 29.035.10 Paper and board insulating materials
  • 31.180 Printed circuits and boards
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Tisk