BS EN IEC 61967-1:2019 - TC

This standard BS EN IEC 61967-1:2019 - TC Tracked Changes. Integrated circuits. Measurement of electromagnetic emissions is classified in these ICS categories:

• 31.200 Integrated circuits. Microelectronics

IEC 61967-1:2018 is available as IEC 61967-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are include in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.
This edition includes the following significant technical changes with respect to the previous edition:
- the frequency range of 150 kHz to 1 GHz has been deleted from the title;
- the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
- Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2 of Annex A;
- the general test board description has been moved to Annex D.