This standard BS EN IEC 62878-1:2019 Device embedding assembly technology is classified in these ICS categories:
31.190 Electronic component assemblies
31.180 Printed circuits and boards
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
