This standard BS EN IEC 63251:2023 Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress is classified in these ICS categories:
31.180 Printed circuits and boards
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
