This standard BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:
31.200 Integrated circuits. Microelectronics
IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.
