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Homepage>BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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sklademVydáno: 2003-03-04
BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

BS EN 60191-6-2:2002

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

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Označení normy:BS EN 60191-6-2:2002
Počet stran:14
Vydáno:2003-03-04
ISBN:0 580 39260 0
Status:Standard
DESCRIPTION

BS EN 60191-6-2:2002


This standard BS EN 60191-6-2:2002 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 01.100.25 Electrical and electronics engineering drawings
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
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