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Homepage>BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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sklademVydáno: 2013-04-30
BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

BS EN 60191-6-22:2013

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

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Označení normy:BS EN 60191-6-22:2013
Počet stran:20
Vydáno:2013-04-30
ISBN:978 0 580 75720 4
Status:Standard
DESCRIPTION

BS EN 60191-6-22:2013


This standard BS EN 60191-6-22:2013 Mechanical standardization of semiconductor devices is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
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