Vážení zákazníci, v letošním roce budeme expedovat poslední objednávky ve středu 18. 12. 2024.

Těšíme se s vámi na shledanou od pondělí 06. 01. 2025.

 

Menu
0
Total price
0 €
PRICES include / exclude VAT
Homepage>BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)
Sponsored link
sklademVydáno: 2003-08-04
BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

BS EN 60191-6-4:2003

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of ball grid array (BGA)

Format
Availability
Price and currency
Anglicky Secure PDF
Immediate download
194.33 €
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standard
for 1 hour
19.43 €
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standard
for 24 hours
58.30 €
Anglicky Hardcopy
In stock
194.33 €
Označení normy:BS EN 60191-6-4:2003
Počet stran:20
Vydáno:2003-08-04
ISBN:0 580 42356 5
Status:Standard
DESCRIPTION

BS EN 60191-6-4:2003


This standard BS EN 60191-6-4:2003 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.