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Homepage>BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

sklademVydáno: 2003-12-15

BS EN 60749-14:2003

Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

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Označení normy:	BS EN 60749-14:2003
Počet stran:	18
Vydáno:	2003-12-15
ISBN:	0 580 43082 0
Status:	Standard

DESCRIPTION

BS EN 60749-14:2003

This standard BS EN 60749-14:2003 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:

31.080.01 Semiconductor devices in general

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

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