This standard BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations is classified in these ICS categories:
31.190 Electronic component assemblies
31.180 Printed circuits and boards
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
