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Homepage>BS EN 61188-5-8:2008 Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

BS EN 61188-5-8:2008

Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

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Označení normy:	BS EN 61188-5-8:2008
Počet stran:	34
Vydáno:	2008-05-30
ISBN:	978 0 580 59958 3
Status:	Standard

DESCRIPTION

BS EN 61188-5-8:2008

This standard BS EN 61188-5-8:2008 Printed boards and printed board assemblies. Design and use is classified in these ICS categories:

31.180 Printed circuits and boards

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.

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