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Homepage>BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

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Označení normy:	BS EN 61189-3-719:2016
Počet stran:	18
Vydáno:	2016-04-30
ISBN:	978 0 580 85142 1
Status:	Standard

DESCRIPTION

BS EN 61189-3-719:2016

This standard BS EN 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:

31.180 Printed circuits and boards

This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

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