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Homepage>BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies

BS EN 61191-3:2017

Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies

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Označení normy:	BS EN 61191-3:2017
Počet stran:	26
Vydáno:	2017-09-25
ISBN:	978 0 580 91722 6
Status:	Standard

DESCRIPTION

BS EN 61191-3:2017

This standard BS EN 61191-3:2017 Printed board assemblies is classified in these ICS categories:

31.240 Mechanical structures for electronic equipment
31.180 Printed circuits and boards

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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