Log inSign up
LANGUAGE czen
Menu
ContactSTOREFAQE-ReadingNews
SEARCH
0
Total price
0 €
PRICES include / exclude VAT
Homepage>BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
sklademVydáno: 2016-11-30
BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

BS EN 62047-25:2016

Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

Format
Availability
Price and currency
Anglicky Secure PDF
Immediate download
247.28 €
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standard
for 1 hour
24.73 €
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standard
for 24 hours
74.18 €
Anglicky Hardcopy
In stock
247.28 €
Označení normy:BS EN 62047-25:2016
Počet stran:28
Vydáno:2016-11-30
ISBN:978 0 580 85615 0
Status:Standard
DESCRIPTION

BS EN 62047-25:2016


This standard BS EN 62047-25:2016 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
  • 31.080.99 Other semiconductor devices
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
Print