PRICES include / exclude VAT
Sponsored link
sklademVydáno: 2013-01-31
BS EN 62047-9:2011
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
Format
Availability
Price and currency
Anglicky Secure PDF
Immediate download
270.58 €
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standardfor 1 hour
27.06 €
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standardfor 24 hours
81.17 €
Anglicky Hardcopy
In stock
270.58 €
| Označení normy: | BS EN 62047-9:2011 |
| Počet stran: | 30 |
| Vydáno: | 2013-01-31 |
| ISBN: | 978 0 580 78793 5 |
| Status: | Standard |
DESCRIPTION
BS EN 62047-9:2011
This standard BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices is classified in these ICS categories:
- 31.080.99 Other semiconductor devices
This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 µm to several millimeters.