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Homepage>BS EN IEC 60068-2-82:2019 Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies
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sklademVydáno: 2019-07-12
BS EN IEC 60068-2-82:2019 Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies

BS EN IEC 60068-2-82:2019

Environmental testing Tests. Test Xw1: Whisker test methods for components and parts used in electronic assemblies

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Označení normy:BS EN IEC 60068-2-82:2019
Počet stran:38
Vydáno:2019-07-12
ISBN:978 0 539 05146 9
Status:Standard
DESCRIPTION

BS EN IEC 60068-2-82:2019


This standard BS EN IEC 60068-2-82:2019 Environmental testing is classified in these ICS categories:
  • 31.190 Electronic component assemblies
  • 19.040 Environmental testing

This part of IEC 60068 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press-fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish. Changes of the physical dimensions of mould compounds, plastics and the like during the required test flow are not considered or assessed. The test methods have been developed by using a knowledge-based approach.

This document can also be used at sub-suppliers, like plating shops, stamping shops or other service providers to ensure a consistent surface quality within the supply chain.

These test methods are employed with defined acceptance criteria by a relevant component or application specification.

The tests described in this document are applicable for initial qualification, for periodic monitoring in accordance with Clause 7, and for changes of technology or manufacturing processes of existing surfaces in accordance with Clause 9.

The mating area of connectors is not covered by this test method. IEC 60512-16-21 applies for the mating areas of connectors.