Menu
0
Total price
0 €
PRICES include / exclude VAT
Homepage>BS EN IEC 60749-5:2024 Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test
sklademVydáno: 2024-02-06
BS EN IEC 60749-5:2024 Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test

BS EN IEC 60749-5:2024

Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test

Format
Availability
Price and currency
Anglicky Secure PDF
Immediate download
178.32 €
You can read the standard for 1 hour. More information in the category: E-reading
Reading the standard
for 1 hour
17.83 €
You can read the standard for 24 hours. More information in the category: E-reading
Reading the standard
for 24 hours
53.50 €
Anglicky Hardcopy
In stock
178.32 €
Označení normy:BS EN IEC 60749-5:2024
Počet stran:14
Vydáno:2024-02-06
ISBN:978 0 539 23216 5
Status:Standard
DESCRIPTION

BS EN IEC 60749-5:2024


This standard BS EN IEC 60749-5:2024 Semiconductor devices. Mechanical and climatic test methods is classified in these ICS categories:
  • 31.080.01 Semiconductor devices in general
IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.