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Homepage>BS EN IEC 61188-6-3:2025 Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)

BS EN IEC 61188-6-3:2025

Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)

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Označení normy:	BS EN IEC 61188-6-3:2025
Počet stran:	36
Vydáno:	2025-02-04
ISBN:	978 0 539 16377 3
Status:	Standard

DESCRIPTION

BS EN IEC 61188-6-3:2025

This standard BS EN IEC 61188-6-3:2025 Circuit boards and circuit board assemblies. Design and use is classified in these ICS categories:

31.190 Electronic component assemblies
31.180 Printed circuits and boards

IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3. This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. This first edition partially cancels and replaces the IEC 61188-5 series of International Standards. The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.

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