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Homepage>BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials
sklademVydáno: 2023-12-25
BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

BS EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Thermal conductivity test for base materials

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Označení normy:BS EN IEC 61189-2-801:2023
Počet stran:16
Vydáno:2023-12-25
ISBN:978 0 539 28571 0
Status:Standard
DESCRIPTION

BS EN IEC 61189-2-801:2023


This standard BS EN IEC 61189-2-801:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
  • 31.180 Printed circuits and boards
This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.
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