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Homepage>BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

BS EN IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

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Označení normy:	BS EN IEC 61189-2-803:2023
Počet stran:	14
Vydáno:	2023-09-13
ISBN:	978 0 539 01306 1
Status:	Standard

DESCRIPTION

BS EN IEC 61189-2-803:2023

This standard BS EN IEC 61189-2-803:2023 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:

31.180 Printed circuits and boards

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

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