Homepage>BS EN IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
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sklademVydáno: 2024-05-30
BS EN IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies X/Y CTE test for thin base materials by TMA
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This standard BS EN IEC 61189-2-805:2024 Test methods for electrical materials, printed boards and other interconnection structures and assemblies is classified in these ICS categories:
31.180 Printed circuits and boards
This part of IEC 61189 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
