Homepage>BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method
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sklademVydáno: 2024-06-04
BS EN IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies Thermal resistance of an assembly by thermal transient method
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This standard BS EN IEC 61189-2-808:2024 Test methods for electrical materials, printed board and other interconnection structures and assemblies is classified in these ICS categories:
31.180 Printed circuits and boards
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
