Homepage>BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
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sklademVydáno: 2023-06-22
BS EN IEC 61249-2-51:2023
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad
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This standard BS EN IEC 61249-2-51:2023 Materials for printed boards and other interconnecting structures is classified in these ICS categories:
29.035.10 Paper and board insulating materials
31.180 Printed circuits and boards
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
