Homepage>BS EN IEC 61760-2:2021 - TC Tracked Changes. Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide
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sklademVydáno: 2021-12-23
BS EN IEC 61760-2:2021 - TC
Tracked Changes. Surface mounting technology Transportation and storage conditions of surface mounting devices (SMD). Application guide
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Označení normy:
BS EN IEC 61760-2:2021 - TC
Počet stran:
48
Vydáno:
2021-12-23
ISBN:
978 0 539 19807 2
Status:
Tracked Changes
DESCRIPTION
BS EN IEC 61760-2:2021 - TC
This standard BS EN IEC 61760-2:2021 - TC Tracked Changes. Surface mounting technology is classified in these ICS categories:
31.240 Mechanical structures for electronic equipment
31.020 Electronic components in general
This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
