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Homepage>BS EN IEC 62878-2-602:2021 Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

sklademVydáno: 2021-08-20

BS EN IEC 62878-2-602:2021

Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

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Označení normy:	BS EN IEC 62878-2-602:2021
Počet stran:	18
Vydáno:	2021-08-20
ISBN:	978 0 539 04645 8
Status:	Standard

DESCRIPTION

BS EN IEC 62878-2-602:2021

This standard BS EN IEC 62878-2-602:2021 Device embedding assembly technology is classified in these ICS categories:

31.180 Printed circuits and boards
31.190 Electronic component assemblies

IEC 62878-2-602:2021 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

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