PRICES include / exclude VAT

Homepage>BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits Terminology

sklademVydáno: 2019-01-24

BS IEC 63011-1:2018

Integrated circuits. Three dimensional integrated circuits Terminology

Anglicky Secure PDF

Immediate download

178.32 €

You can read the standard for 1 hour. More information in the category: E-reading

Reading the standard

for 1 hour

17.83 €

You can read the standard for 24 hours. More information in the category: E-reading

Reading the standard

for 24 hours

53.50 €

Anglicky Hardcopy

In stock

178.32 €

Označení normy:	BS IEC 63011-1:2018
Počet stran:	16
Vydáno:	2019-01-24
ISBN:	978 0 580 96278 3
Status:	Standard

DESCRIPTION

BS IEC 63011-1:2018

This standard BS IEC 63011-1:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:

31.200 Integrated circuits. Microelectronics

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Print RECOMMEND