PRICES include / exclude VAT

Homepage>BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect

sklademVydáno: 2019-01-24

BS IEC 63011-2:2018

Integrated circuits. Three dimensional integrated circuits Alignment of stacked dies having fine pitch interconnect

Anglicky Secure PDF

Immediate download

178.32 €

You can read the standard for 1 hour. More information in the category: E-reading

Reading the standard

for 1 hour

17.83 €

You can read the standard for 24 hours. More information in the category: E-reading

Reading the standard

for 24 hours

53.50 €

Anglicky Hardcopy

In stock

178.32 €

Označení normy:	BS IEC 63011-2:2018
Počet stran:	18
Vydáno:	2019-01-24
ISBN:	978 0 580 97375 8
Status:	Standard

DESCRIPTION

BS IEC 63011-2:2018

This standard BS IEC 63011-2:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:

31.200 Integrated circuits. Microelectronics

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Print RECOMMEND