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Homepage>BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits Model and measurement conditions of through-silicon via

sklademVydáno: 2019-01-24

BS IEC 63011-3:2018

Integrated circuits. Three dimensional integrated circuits Model and measurement conditions of through-silicon via

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Označení normy:	BS IEC 63011-3:2018
Počet stran:	18
Vydáno:	2019-01-24
ISBN:	978 0 580 96279 0
Status:	Standard

DESCRIPTION

BS IEC 63011-3:2018

This standard BS IEC 63011-3:2018 Integrated circuits. Three dimensional integrated circuits is classified in these ICS categories:

31.200 Integrated circuits. Microelectronics

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

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