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BS IEC 60747-18-4:2023
Semiconductor devices Semiconductor bio sensors. Evaluation method of noise characteristics of lens-free CMOS photonic array sensors

Vydáno: 2023-03-27

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BS EN IEC 60749-10:2022
Semiconductor devices. Mechanical and climatic test methods Mechanical shock. device and subassembly

Vydáno: 2022-08-16

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BS IEC 63229:2021
Semiconductor devices. Classification of defects in gallium nitride epitaxial film on silicon carbide substrate

Vydáno: 2023-08-31

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24/30497546 DC
BS EN IEC 60749-24 Semiconductor devices. Mechanical and climatic test methods Part 24. Accelerated moisture resistance. Unbiased HAST

Vydáno: 2024-09-06

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24/30497542 DC
BS EN IEC 60749-21 Semiconductor devices. Mechanical and climatic test methods Part 21. Solderability

Vydáno: 2024-09-06

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BS IEC 60747-1:2006+A1:2010
Semiconductor devices General

Vydáno: 2010-07-31

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BS IEC 60747-9:2019
Semiconductor devices Discrete devices. Insulated-gate bipolar transistors (IGBTs)

Vydáno: 2019-11-22

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BS EN 60191-6-3:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP)

Vydáno: 2001-05-15

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BS EN 60745-1:2009+A11:2010
Hand-held motor-operated electric tools. Safety General requirements

Vydáno: 2011-02-28

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BS EN 60191-6-12:2011
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

Vydáno: 2011-08-31

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BS EN 60749-14:2003
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)

Vydáno: 2003-12-15

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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) of integrated circuits

Vydáno: 1997-09-15

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157 results

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