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Homepage>BSI Standards>31 ELEKTRONIKA>31.080 Polovodičové součástky>31.080.01 Polovodičové součástky obecně

31.080.01 Polovodičové součástky obecně

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167 results
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BS IEC 63068-3:2020
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Test method for defects using photoluminescence
Vydáno: 2020-07-24
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BS IEC 60747-18-3:2019
Semiconductor devices Semiconductor bio sensors. Fluid flow characteristics of lens-free CMOS photonic array sensor package modules with fluidic system
Vydáno: 2020-01-14
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BS EN IEC 60749-30:2020
Semiconductor devices. Mechanical and climatic test methods Preconditioning of non-hermetic surface mount devices prior to reliability testing
Vydáno: 2020-09-30
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BS EN 60749-7:2011
Semiconductor devices. Mechanical and climatic test methods Internal moisture content measurement and the analysis of other residual gases
Vydáno: 2011-09-30
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PD IEC TR 63378-1:2021
Thermal standardization on semiconductor packages Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
Vydáno: 2022-01-11
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BS IEC 60191-2:1966+A21:2020
Mechanical standardization of semiconductor devices Dimensions
Vydáno: 2020-04-02
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BS EN IEC 60068-2-13:2021
Environmental testing Tests. Test M: Low air pressure
Vydáno: 2021-04-26
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BS EN 60191-6-18:2010
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
Vydáno: 2010-10-31
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BS EN 60191-6-5:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)
Vydáno: 2001-11-15
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BS EN 60749-8:2003
Semiconductor devices. Mechanical and climatic test methods Sealing
Vydáno: 2003-07-03
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BS EN 60191-6-1:2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for gull-wing lead terminals
Vydáno: 2002-03-29
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BS EN 60191-4:2014+A1:2018
Mechanical standardization of semiconductor devices Coding system and classification into forms of package outlines for semiconductor device packages
Vydáno: 2018-05-30
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167 results
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