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BS EN IEC 63364-1:2022
Semiconductor devices. Semiconductor devices for IoT system Test method of sound variation detection
Semiconductor devices. Semiconductor devices for IoT system Test method of sound variation detection
Vydáno: 2023-02-02
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194.33 €
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19.43 €
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58.30 €
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194.33 €
BS IEC 63284:2022
Semiconductor devices. Reliability test method by inductive load switching for gallium nitride transistors
Semiconductor devices. Reliability test method by inductive load switching for gallium nitride transistors
Vydáno: 2022-11-11
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19.43 €
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58.30 €
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194.33 €
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194.33 €
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19.43 €
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58.30 €
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194.33 €
BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Vydáno: 2011-09-30
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58.30 €
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BS IEC 62951-1:2017
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
Semiconductor devices. Flexible and stretchable semiconductor devices Bending test method for conductive thin films on flexible substrates
Vydáno: 2018-05-04
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58.30 €
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19.43 €
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58.30 €
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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Vydáno: 2012-05-31
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270.58 €
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27.06 €
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81.17 €
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BS IEC 62047-33:2019
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Semiconductor devices. Micro-electromechanical devices MEMS piezoresistive pressure-sensitive device
Vydáno: 2019-04-18
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81.17 €
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BS EN 62047-4:2010
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Semiconductor devices. Micro-electromechanical devices Generic specification for MEMS
Vydáno: 2010-11-30
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BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Vydáno: 2021-07-07
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317.32 €
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31.73 €
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95.20 €
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317.32 €