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31.180 Plošné spoje a desky s plošnými spoji

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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Vydáno: 2007-10-31

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BS EN 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys

Vydáno: 2013-07-31

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BS 123300:2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards

Vydáno: 2001-12-17

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PD IEC/TR 63018:2015
Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials

Vydáno: 2015-12-16

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PD IEC/TS 62878-2-4:2015
Device embedded substrate Guidelines. Test element groups (TEG)

Vydáno: 2015-04-30

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BS CECC 265001:1998
Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits

Vydáno: 1999-07-15

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BS 123500-003:2001
System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections

Vydáno: 2001-12-17

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BS 123600:2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections

Vydáno: 2001-12-17

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BS EN 61249-3-5:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Transfer adhesive films for flexible printed boards

Vydáno: 1999-06-15

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BS EN 61249-2-39:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2013-04-30

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BS EN IEC 61189-5-601:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Vydáno: 2021-03-19

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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Vydáno: 2014-02-28

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