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31.180 Plošné spoje a desky s plošnými spoji

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BS EN 61189-5-1:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies

Vydáno: 2016-10-31

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BS EN 61249-2-43:2016
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2016-07-31

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BS EN 61249-4-17:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Vydáno: 2009-10-31

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BS EN 61249-3-4:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyimide film

Vydáno: 1999-06-15

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BS EN 61249-2-19:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad

Vydáno: 2002-05-02

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BS CECC 23300-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards

Vydáno: 1998-06-15

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BS EN 61249-8-8:1997
Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings

Vydáno: 1997-12-15

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BS EN 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Vydáno: 2016-04-30

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BS IEC 62899-204:2019
Printed electronics Materials. Insulator ink. Measurement methods of properties of insulator inks and printed insulating layers

Vydáno: 2019-06-07

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BS EN 60194:2006
Printed board design, manufacture and assembly. Terms and definitions

Vydáno: 2006-09-29

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BS 123800:2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections

Vydáno: 2001-12-17

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BS CECC 123500-003:1994
Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections

Vydáno: 1994-02-15

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