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31.180 Plošné spoje a desky s plošnými spoji

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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

Vydáno: 1990-02-28

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BS EN 61249-4-18:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Vydáno: 2014-02-28

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BS EN 61249-2-18:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper clad

Vydáno: 2002-05-10

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BS EN 61249-2-37:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2009-04-30

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BS EN 61188-1-1:1997
Printed boards and assemblies. Design and use. Generic requirements Flatness considerations for electronic assemblies

Vydáno: 1997-12-15

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BS EN 61193-1:2002
Quality assessment systems Registration and analysis of defects on printed board assemblies

Vydáno: 2002-05-14

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BS EN IEC 62878-2-5:2019
Device embedding assembly technology Guidelines. Implementation of a 3D data format for device embedded substrate

Vydáno: 2019-11-18

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BS EN IEC 61188-6-4:2019
Printed boards and printed board assemblies. Design and use Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Vydáno: 2019-07-12

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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

Vydáno: 2018-04-13

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BS 123800-003:2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections

Vydáno: 2001-12-17

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BS EN 61188-1-2:1998
Printed boards and assemblies. Design and use. Generic requirements Generic requirements. Controlled impedance

Vydáno: 1998-12-15

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DD IEC/PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Vydáno: 2007-10-31

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