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31.180 Plošné spoje a desky s plošnými spoji

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BS EN IEC 61189-5-503:2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards

Vydáno: 2018-04-13

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BS EN 61249-2-10:2003
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Vydáno: 2006-08-31

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BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2009-04-30

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology

Vydáno: 2015-04-30

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BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Copper foils (for the manufacture of copper-clad base materials)

Vydáno: 1996-09-15

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BS 4584-103.2:1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials

Vydáno: 1990-02-28

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BS 123200-003:2001
System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes

Vydáno: 2001-12-17

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BS EN 61249-4-12:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability

Vydáno: 2006-02-01

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BS EN 61086-3-1:2004
Coatings for loaded printed wire boards (conformal coatings) Specifications for individual materials

Vydáno: 2004-05-21

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BS EN 123400-800:1992
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections

Vydáno: 1991-12-20

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PD IEC/TR 62878-2-2:2015
Device embedded substrate Guidelines. Electrical testing

Vydáno: 2015-12-31

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BS EN 62496-4:2011
Optical circuit boards Interface standards. General and guidance

Vydáno: 2011-03-31

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254 results

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