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31.180 Plošné spoje a desky s plošnými spoji

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DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide

Vydáno: 2010-11-30

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PD IEC PAS 61191-10:2022
Printed board assemblies Application and utilization of protective coatings for electronic assemblies

Vydáno: 2022-09-13

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BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates

Vydáno: 2022-04-06

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BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Vydáno: 2022-05-06

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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

Vydáno: 2023-09-13

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BS EN IEC 61249-6-3:2023
Materials for printed boards and other interconnecting structures Sectional specification set for reinforcement materials. Specification for finished fabric woven from "E" glass for printed boards

Vydáno: 2023-08-08

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BS EN IEC 61188-6-3:2025
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for through hole components (THT)

Vydáno: 2025-02-04

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24/30493202 DC
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate

Vydáno: 2024-05-10

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BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design

Vydáno: 2023-11-08

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BS EN 61249-2-35:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2009-04-30

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PD IEC/TS 62878-2-1:2015
Device embedded substrate Guidelines. General description of technology

Vydáno: 2015-04-30

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BS EN IEC 61249-2-46:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2018-04-16

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