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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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20/30394594 DC
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element
Vydáno: 2020-12-04
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PD IEC TR 62899-250:2025
Printed electronics Material technologies required in printed electronics for wearable smart devices
Printed electronics Material technologies required in printed electronics for wearable smart devices
Vydáno: 2025-03-17
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BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design
Format for LSI-Package-Board Interoperable design
Vydáno: 2023-11-08
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24/30493202 DC
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
Vydáno: 2024-05-10
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BS 123100-003:2001
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes
Vydáno: 2001-12-17
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BS EN 61249-7-1:1996
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
Vydáno: 1996-08-15
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