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31.180 Plošné spoje a desky s plošnými spoji

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BS EN 61249-4-16:2009
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Vydáno: 2009-10-31

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BS EN 60097:1993
Specification for grid systems for printed circuits

Vydáno: 1993-04-15

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BS EN 61189-2-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)

Vydáno: 2016-10-31

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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library

Vydáno: 2021-01-22

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BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate

Vydáno: 2020-12-11

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22/30442107 DC
Printed Electronics Part 507-1. Quality assessment. Printed electrode and rivet connection to wire terminal

Vydáno: 2022-06-17

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23/30473810 DC
BS IEC 63240-1. Active assisted living (AAL) reference architecture and architecture model Part 1. Reference architecture

Vydáno: 2023-05-26

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PD IEC TR 61191-9:2023
Printed board assemblies Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications. Best practices

Vydáno: 2023-06-19

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries

Vydáno: 2022-08-23

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BS EN IEC 61189-2-720:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies Detection of defects in interconnection structures by measurement of capacitance

Vydáno: 2024-04-17

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BS EN IEC 61249-6-3:2023 - TC
Tracked Changes. Materials for printed boards and other interconnecting structures Sectional specification set for reinforcement materials. Specification for finished fabric woven from "E" glass for printed boards

Vydáno: 2023-09-06

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23/30436874 DC
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

Vydáno: 2023-10-23

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254 results

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