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31.180 Plošné spoje a desky s plošnými spoji

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23/30436874 DC
BS EN IEC 62878-2-603. Device embedding assembly technology Part 2-603. Guideline for stacked electronic module. Test method of intra-module electrical connectivity

Vydáno: 2023-10-23

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BS EN IEC 60947-4-3:2024
Low-voltage switchgear and controlgear Contactors and motor-starters. Semiconductor controllers and semiconductor contactors for non-motor loads

Vydáno: 2024-12-18

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25/30507775 DC
BS IEC 62899-202-14 Printed electronics Part 202-14: Materials - Test methods of conductive ink suitability for screen printing

Vydáno: 2024-12-20

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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries

Vydáno: 2022-08-23

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24/30477141 DC
BS ISO 13060 An adhesion evaluation method for microcircuits on PCB (Printed Circuit Board) by scratch test

Vydáno: 2024-08-09

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24/30499026 DC
BS EN IEC 61249-2-54 Materials for printed boards and other interconnecting structures Part 2-54. Reinforced base materials clad and unclad. Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

Vydáno: 2024-08-16

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21/30431274 DC
BS EN 61188-6-3. Circuit boards and circuit board assemblies. Design and use Part 6-3. Land pattern design. Description of land pattern for through hole components (THT)

Vydáno: 2021-01-06

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BS EN IEC 61189-5-502:2021
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies

Vydáno: 2021-03-18

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes

Vydáno: 2021-03-12

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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method

Vydáno: 2021-03-11

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Vydáno: 2021-08-20

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BS IEC 62899-202-3:2019
Printed electronics Materials. Conductive ink. Measurement of sheet resistance of conductive films. Contactless method

Vydáno: 2019-01-23

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257 results

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