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BS 123100:2001
System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes
Vydáno: 2001-12-17
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BS EN 60079-27:2008
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Explosive atmospheres Fieldbus intrinsically safe concept (FISCO)
Vydáno: 2008-07-31
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DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards
Performance guide for single- and double-sided flexible printed wiring boards
Vydáno: 2007-06-29
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BS IEC 62899-401:2017
Printed electronics Printability. Overview
Printed electronics Printability. Overview
Vydáno: 2017-03-31
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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Vydáno: 2010-05-31
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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Vydáno: 1998-08-15
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BS 123700:2001
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections
Vydáno: 2001-12-17
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BS EN 61249-2-6:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2006-08-31
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PD IEC TR 61191-8:2021
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Printed board assemblies Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Vydáno: 2021-03-25
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PD IEC TR 62878-2-8:2021
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Device embedding assembly technology Guidelines. Warpage control of active device embedded substrate
Vydáno: 2021-07-29
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