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31.180 Plošné spoje a desky s plošnými spoji

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BS IEC 62899-201:2016+A1:2018
Printed electronics Materials. Substrates

Vydáno: 2019-01-03

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BS EN IEC 62878-2-602:2021
Device embedding assembly technology Guideline for stacked electronic module. Evaluation method of inter-module electrical connectivity

Vydáno: 2021-08-20

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BS IEC 62899-202-7:2021
Printed electronics Materials. Printed film. Measurement of peel strength for printed layer on flexible substrate by the 90° peel method

Vydáno: 2021-03-11

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BS EN IEC 61189-5-501:2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of solder fluxes

Vydáno: 2021-03-12

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BS IEC 62899-202-5:2018
Printed electronics Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate

Vydáno: 2018-10-09

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BS EN 61249-2-11:2003
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad

Vydáno: 2006-06-30

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BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides

Vydáno: 2007-12-31

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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology

Vydáno: 2014-10-31

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BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

Vydáno: 2015-06-30

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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods

Vydáno: 2015-07-31

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PD IEC/TR 62899-250:2016
Printed electronics Material technologies required in printed electronics for wearable smart devices

Vydáno: 2017-01-31

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BS CECC 23800-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections

Vydáno: 1998-06-15

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254 results

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