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BS EN 61249-5-4:1997
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings Conductive inks
Vydáno: 1997-05-15
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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies
Printed board assemblies Technical cleanliness of components and printed board assemblies
Vydáno: 2020-03-23
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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library
Vydáno: 2021-01-22
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PD IEC TR 62878-2-9:2022
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Device embedding assembly technology Guidelines. Concept of JISSO level in the electronic assembly technology industries
Vydáno: 2022-08-23
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BS EN 61189-5:2006
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
Vydáno: 2009-02-28
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BS IEC 62899-402-1:2017
Printed electronics Printability. Measurement of qualities. Pattern width
Printed electronics Printability. Measurement of qualities. Pattern width
Vydáno: 2017-03-31
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