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31.180 Plošné spoje a desky s plošnými spoji

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BS 123600-003:2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections

Vydáno: 2001-12-17

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BS IEC 62899-403-1:2018
Printed electronics Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine

Vydáno: 2018-06-27

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BS CECC 23700-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections

Vydáno: 1998-06-15

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BS IEC 62899-202-6:2020
Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. Printed conductive layer on a flexible substrate

Vydáno: 2020-12-11

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BS EN IEC 61249-2-47:2018
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

Vydáno: 2018-04-18

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PD IEC TR 61191-7:2020
Printed board assemblies Technical cleanliness of components and printed board assemblies

Vydáno: 2020-03-23

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PD IEC TR 61188-8:2021
Circuit boards and circuit board assemblies. Design and use 3D shape data for CAD component library

Vydáno: 2021-01-22

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DD IEC/PAS 62326-7-1:2007
Performance guide for single- and double-sided flexible printed wiring boards

Vydáno: 2007-06-29

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BS IEC 62899-401:2017
Printed electronics Printability. Overview

Vydáno: 2017-03-31

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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

Vydáno: 2010-05-31

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BS EN 61249-2-27:2013
Materials for printed boards and other interconnecting structures Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Vydáno: 2013-04-30

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BS CECC 200025:1998
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities

Vydáno: 1998-08-15

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