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Homepage>BSI Standards>31 ELEKTRONIKA>31.180 Plošné spoje a desky s plošnými spoji

31.180 Plošné spoje a desky s plošnými spoji

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257 results
First page1245678...202122Last page
BS EN 61249-2-8:2003
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Vydáno: 2003-08-14
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BS EN 16602-70-12:2016
Space product assurance. Design rules for printed circuit boards
Vydáno: 2016-10-31
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BS EN 61182-2-2:2012
Printed board assembly products. Manufacturing description data and transfer methodology Sectional requirements for implementation of printed board fabrication data description
Vydáno: 2012-08-31
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BS EN 61290-4-2:2011
Optical amplifiers. Test methods Gain transient parameters. Broadband source method
Vydáno: 2011-10-31
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BS IEC 62899-402-2:2020
Printed electronics Printability. Measurement of qualities. Edge waviness
Vydáno: 2020-09-04
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BS EN 61249-2-38:2009
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Vydáno: 2009-06-30
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BS EN 123100:1992
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
Vydáno: 1989-09-29
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BS EN 61249-3-3:1999
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) Adhesive coated flexible polyester film
Vydáno: 1999-06-15
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BS EN 61188-5-8:2008
Printed boards and printed board assemblies. Design and use Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
Vydáno: 2008-05-30
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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
Vydáno: 2021-03-19
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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards
Vydáno: 2019-04-01
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BS EN IEC 61189-5-504:2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Process ionic contamination testing (PICT)
Vydáno: 2020-06-17
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257 results
First page1245678...202122Last page