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31.180 Plošné spoje a desky s plošnými spoji

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PD IEC/PAS 61249-8-1:2014
Qualification and performance of electrical insulating compound for printed wiring assemblies

Vydáno: 2014-06-30

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BS EN 61188-5-3:2007
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides

Vydáno: 2007-12-31

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PD IEC/PAS 61182-12:2014
Generic requirements for printed board assembly products manufacturing description data and transfer methodology

Vydáno: 2014-10-31

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BS EN 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

Vydáno: 2015-06-30

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BS EN 62878-1-1:2015
Device embedded substrate Generic specification. Test methods

Vydáno: 2015-07-31

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PD IEC/TR 61189-3-914:2017
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines

Vydáno: 2017-03-31

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PD IEC/PAS 61249-8-5:2014
Qualification and performance specification of permanent solder mask and flexible cover materials

Vydáno: 2014-06-30

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BS EN 61189-1:1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods and methodology

Vydáno: 2002-06-21

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BS CECC 23800-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections

Vydáno: 1998-06-15

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BS EN 61249-2-7:2002
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Vydáno: 2006-08-31

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PD IEC/TS 62878-2-3:2015
Device embedded substrate Guidelines. Design guide

Vydáno: 2015-04-30

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BS EN 123500:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections

Vydáno: 1990-11-30

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257 results

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