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31.180 Plošné spoje a desky s plošnými spoji

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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates

Vydáno: 2019-05-13

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DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide

Vydáno: 2010-11-30

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BS EN IEC 61191-1:2018
Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Vydáno: 2018-11-13

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BS EN 61249-4-19:2013
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Vydáno: 2014-02-28

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BS EN 61249-2-1:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad

Vydáno: 2005-08-09

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BS EN 61249-4-5:2005
Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability

Vydáno: 2006-02-01

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BS EN 60191-6-16:2007
Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Vydáno: 2007-07-31

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PD IEC TR 62878-2-7:2019
Device embedding assembly technology Guidelines. Accelerated stress testing of passive embedded circuit boards

Vydáno: 2019-04-01

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BS EN IEC 61188-6-2:2021
Circuit boards and circuit board assemblies. Design and use Land pattern design. Description of land pattern for the most common surface mounted components (SMD)

Vydáno: 2021-03-19

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BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume

Vydáno: 2018-05-18

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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad

Vydáno: 2005-08-24

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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Vydáno: 2014-05-07

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254 results

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