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31.180 Plošné spoje a desky s plošnými spoji

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BS EN IEC 61189-5-504:2020
Test methods for electrical materials, printed board and other interconnection structures and assemblies General test methods for materials and assemblies. Process ionic contamination testing (PICT)

Vydáno: 2020-06-17

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PD IEC TR 61189-5-506:2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

Vydáno: 2019-07-18

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BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension

Vydáno: 2017-11-16

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BS EN 61249-2-13:1999
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Vydáno: 1999-06-15

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BS EN 123100:1992
Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes

Vydáno: 1989-09-29

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BS EN 61189-3:2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)

Vydáno: 2008-03-31

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BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards

Vydáno: 1989-08-31

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BS IEC 62899-201-2:2021
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates

Vydáno: 2022-04-06

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BS EN IEC 61189-2-501:2022
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

Vydáno: 2022-05-06

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BS EN IEC 61189-2-803:2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for Z-axis expansion of base materials and printed boards

Vydáno: 2023-09-13

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BS IEC 63055:2023
Format for LSI-Package-Board Interoperable design

Vydáno: 2023-11-08

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24/30493202 DC
BS IEC 62899-403-2 Printed electronics Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate

Vydáno: 2024-05-10

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254 results

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