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BS EN 123300:1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
Vydáno: 1989-08-31
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20/30394594 DC
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element
BS IEC 62899-506-1. Printed electronics Part 506-1. Quality assessment- Accelerated stress test of printed heating element
Vydáno: 2020-12-04
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BS IEC 62899-302-2:2018
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Printed electronics Equipment. Inkjet. Imaging-based measurement of droplet volume
Vydáno: 2018-05-18
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BS EN 61249-2-22:2005
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Materials for printed boards and other interconnecting structures Reinforced base materials, clad and unclad
Vydáno: 2005-08-24
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PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
Vydáno: 2014-05-07
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19/30357467 DC
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
Vydáno: 2019-05-13
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DD IEC/PAS 62326-14:2010
Printed boards Device embedded substrate. Terminology / reliability / design guide
Printed boards Device embedded substrate. Terminology / reliability / design guide
Vydáno: 2010-11-30
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BS IEC 62899-301-2:2017
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Vydáno: 2017-11-16
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